DM200-250型磁控溅射系统

This coating system features a circular vacuum chamber structure with rear evacuation and a front-opening door, constructed from high-quality austenitic stainless steel. One (or two) 2-inch (or 3-inch) magnetron sputtering targets are mounted on the top plate of the sputtering deposition chamber, with the emitted beam directed towards the substrate holder to deposit thin films on the substrate. This simple device can be used for the research and development of nanoscale single-layer and multilayer functional films, such as hard films, metal films, semiconductor films, dielectric films, composite films, ferromagnetic films, and magnetic thin films, among other novel thin film materials.

System main parameters

• Ultimate vacuum: ≤6×10⁻⁵ Pa (obtained within 12 hours under cleaning + baking degassing conditions);
• Vacuuming time: within 30 minutes, ≤6×10⁻⁴ Pa;
• Substrate heating temperature: ≤600℃;
• Substrate size: ≤φ3inch circular substrate;
• Number of substrate holders: 1 set;
• Target size: 50mm in diameter (3-inch optional);
• Number of targets: 1 or 2;
• Vacuum chamber dimensions: DN250*340 (may be adjusted appropriately based on actual conditions);
• Substrate holder movement distance: ≤50mm (axial direction);
• Angle between the target axis and the substrate rotation axis: co-sputtering;
• Air supply system: 2 air intakes, 1 of which is for venting;

System main configuration description