DM300 Magnetron sputtering system
Factory-direct supplier of compact ultra-high vacuum magnetron sputtering machines with OEM customization and reliable thin film coating solutions.
Product Description
This small-scale coating machine features a compact structure, a simple and elegant appearance, easy operation and maintenance, and low operating costs. The main unit and electrical control system are integrated into a single design. The main unit consists of a frame, a pump system, and a vacuum chamber. The coating process takes place within the sputtering vacuum chamber; the electrical control system uses a standard control cabinet containing modular modules, providing powerful functionality and stable performance.
The basic parameters of this ultra-high vacuum magnetron sputtering coating machine are as follows:
- Coating chamber ultimate vacuum: ≤6×10⁻⁵Pa;
- Evacuation time: Better than 6×10⁻⁴ Pa within 30 minutes;
- Vacuum chamber dimensions: 300×300×H350mm, the vacuum chamber is made of stainless steel;
- Target size and quantity: 2 φ50mm permanent magnet targets;
- Target-base distance is adjustable (40~100mm, adjusted via target position);
- Substrate rotation: adjustable from 0 to 60 rpm; equipped with heating, up to 500 degrees Celsius;
- Main unit dimensions: Approximately 1100mm (L) × 750mm (W) × 1650mm (H);
- Gas type: 2-channel MFC, working gas Ar + reactant gas;
- Film thickness measurement: Equipped with a quartz crystal film thickness gauge and original probe (optional);
- Control system: It adopts touch screen + PLC control, and the control includes pump, valve start and stop and output alarm functions;
System main configuration description
| Item | Specifications and Instructions | |
| Vacuum room | sputtering vacuum chamber | 300×300×H350 mm , dimensions may be adjusted according to design requirements , door opening. |
| Ultra-high vacuum throttle valve | DN150, electrically controlled, with optional automatic constant pressure function. | |
| molecular pump | 620L/S molecular pump | |
| mechanical pump | The BSV 30 rotary vane pump functions as both a pre-pump and a backing pump. | |
| baffle valve | DN40 electromagnetic baffle valve, pre-extraction pipeline on/off | |
| gate valve | 6 mm double ferrule interface electric shut-off valve | |
| Lighting and baking equipment | Baking Options | |
| Various types of flanges and observation windows | DN16, 35, 63, 100, 150 | |
| Stainless steel pipes and fittings | Precision stainless steel pipes, corrugated pipes, and pipe fittings of various specifications | |
| Vacuum Test and enter gas | Digital display composite vacuum gauge | 5227 composite vacuum gauge or imported full-range gauge tube are optional. |
| Bare metal gauge | ZJ 52T, ZJ 27 metal interface | |
| mass flow controller | Two sets of D07-7B mass flow controllers, one each with a range of 50 sccm and 100 sccm. | |
| Piping and fittings | Mixing chamber | |
| gate valve | 6 mm double ferrule interface, electric shut-off valve | |
| Intake and other control interfaces | The pressure regulating valve is electrically controlled and has feedback capability. | |
| Sample rack | Rotating substrate holder | Substrate rotation, substrate holder lifting |
| Lifting device | Manual lifting adjustment available, electric lifting optional. | |
| Sputtering substrate heating device | ≤600℃ heating device optional | |
| Temperature control power supply | Shimadzu temperature controller from Japan, PID temperature control. | |
| Sputtering system | Magnetron sputtering target | Two integrated splash targets, 2-inch or 3-inch, with baffles. |
| Sputtering power supply | One 500W DC power supply and one 500W auto-matching RF power supply. | |
| Equipment rack | Integrated layout | |
| Water-gas system | Including cooling water machine | |
| control system | Standard manual control, optional touchscreen automatic control | |
