DM400 Magnetron sputtering system
Factory supplier of ultra-high vacuum magnetron sputtering systems with multi-target co-sputtering technology and customized PVD solutions for advanced thin film applications.
Product Description
Main parameters of the system:
l Ultimate vacuum degree: ≤5×10-5Pa (obtained within 12 hours under cleaning + baking and degassing conditions);
l Vacuuming time: within 40 minutes, ≤5×10-4Pa;
l Substrate heating temperature: ≤600℃ (heating by iodine tungsten lamp);
l Substrate size: ≤Φ3inch wafer;
l Target size: 2 inches or 3 inches;
l Number of targets: 3;
l Vacuum chamber size: 400×400×H380~450 (may be adjusted appropriately according to actual conditions);
l Substrate rack moving distance: ≤50mm (axial direction);
l Angle between target axis and substrate rotation axis: co-sputtering;
l Gas system: 4 air intakes, 1 of which is for exhaust;
System main configuration description
| Item | Specifications and Description | |
| Vacuum Chamber | Sputtering vacuum chamber | 400×400×H400mm, the size should be adjusted according to the design requirements, and the door should be opened |
| Ultra-high vacuum throttle valve | DN200, electric control, optional automatic constant pressure function | |
| Molecular pump | Molecular pump 1200L/S | |
| Mechanical pump | BSV30 rotary vane pump, also acts as pre-pump and fore pump | |
| Flap valve | DN40 electromagnetic flapper valve, pre-pumping pipeline on and off | |
| Stop valve | 6mm double ferrule interface electric stop valve | |
| Lighting and baking equipment | Baking options | |
| Various flanges and observation windows | DN16, 35, 63, 100, 200 | |
| Stainless steel pipes and pipe joints | Various specifications of precision stainless steel pipes, bellows, pipe joints | |
| Vacuum measurement and air intake | Digital compound vacuum gauge | 5227 compound vacuum gauge or imported full range gauge optional |
| Bare Metal Gauge | ZJ52T, ZJ27 metal interface | |
| Mass Flow Controllers | D07-7B mass flow controller 3 sets | |
| Pipes and connectors | Mixing chamber | |
| Stop valve | 6mm double ferrule interface electric stop valve | |
| Air intake and other control interfaces | Pressure regulating valve electric control, feedback | |
| Sample rack | Rotating substrate holder | Substrate rotation, substrate rack lifting, substrate bias optional |
| Lifting device | Electric lifting, with position display | |
| Sputtering substrate heating device | ≤600℃ Heating device optional | |
| Temperature Control Power Supply | Japanese Shimaden temperature control, PID temperature control | |
| Sputtering system | Magnetron sputtering target | 3 sets of integrated sputtering targets, 2 inches or 3 inches, with baffles |
| Sputtering power supply | 2 500W DC power supplies and 1 500W automatic matching RF power supply | |
| Equipment rack | Integrated layout | |
| Water and gas system | With cooling water machine | |
| Control System | Standard touch screen automatic control | |
