DM500 E-beam Evaporation Coating System
Product Description
Main technical parameters:
- Vacuum chamber: φ500*H650mm;
- Maximum plated workpiece diameter: φ400mm; Umbrella-shaped sample holder;
- Ultimate vacuum: Better than 6*10-5 Pa;
- Evacuation time: At atmospheric pressure ~6*10-4 Pa, less than 30 min;
- Evaporation: Resistance evaporation electrodes (6~8 pairs) Power: 2KW; Equipped with 3~4 sets of digital display evaporation power supplies, one of which can be switched to 2 sets of electrodes.
- Opening method: Front opening structure, which facilitates wire replacement and material loading;
- Vacuum system: mechanical pump + molecular pump;
- Film thickness gauge: Quartz crystal film thickness gauge, equipped with a water-cooled probe;
System main configuration description
| project | Specifications and Instructions | |
| vacuum chamber | Evaporation vacuum chamber | φ500*H650mm, dimensions may be adjusted according to design requirements, side-opening door. |
| molecular pump | 1600L/S molecular pump | |
| mechanical pump | The BSV40 rotary vane pump functions as both a pre-pump and a backing pump. | |
| baffle valve | DN40 electromagnetic baffle valve, pre-extraction pipeline on/off | |
| gate valve | 6mm double ferrule interface electric shut-off valve | |
| Lighting and baking equipment | Optional | |
| Various types of flanges and observation windows | DN16, 35, 63, 100, 250 | |
| Stainless steel pipes and fittings | Precision stainless steel pipes, corrugated pipes, and pipe fittings of various specifications | |
| Vacuum measurement and air intake | Digital display composite vacuum gauge | 5227 composite vacuum gauge or imported full-range gauge tube are optional. |
| Bare metal gauge | ZJ52T, ZJ27 metal interface | |
| Piping and fittings | valves | |
| gate valve | 6mm double ferrule interface, electric shut-off valve | |
| Intake and other control interfaces | Manual or electric control | |
| Sample rack | Rotating substrate holder | Substrate rotation, substrate holder lifting |
| Lifting device | Lifting can be adjusted manually or electrically. | |
| Substrate heating device | ≤400℃ heating device optional | |
| Temperature control power supply | Shimaden temperature controller from Japan, PID temperature control optional. | |
| Evaporation Coating System | Evaporation source | Water-cooled evaporation source, 3-4 sets are optional |
| Evaporation power supply | 8-200A, 3-4 sets | |
| High-pressure bombardment | plasma cleaning | |
| Film thickness gauge | Quartz crystal film thickness gauge, optional film thickness controller, automatic coating | |
| Equipment rack | Split layout | |
| Water-gas system | Including cooling water machine | |
| control system | Standard manual control, optional touchscreen automatic control | |
